Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape

A method of marking a packaged semiconductor device having a semiconductor die comprising:

• providing a semiconductor die in wafer form;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a semiconductor die comprising:

• providing a semiconductor die having a reduced cross-section in wafer form;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device comprising:

• providing a semiconductor die having a reduced cross-section in sliced wafer form;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device having a semiconductor die comprising:

• providing a semiconductor die in sliced wafer form;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a semiconductor die comprising:

• providing a semiconductor die having a reduced cross-section in sliced wafer form;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device comprising:

• providing a semiconductor die having a reduced cross-section as a portion of a wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device having a semiconductor die comprising:

• providing a semiconductor die as a portion of a wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a semiconductor die comprising:

• providing a semiconductor die having a reduced cross-section as a portion of a wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device comprising:

• providing a semiconductor die having a reduced cross-section as a portion of a sliced wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a packaged semiconductor device having a semiconductor die comprising:

• providing the semiconductor die as a portion of a sliced wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.

A method of marking a semiconductor die comprising:

• providing a semiconductor die having a reduced cross-section as a portion of a sliced wafer;
• packaging the semiconductor die forming a packaged semiconductor device, the packaged semiconductor device having a surface;
• applying a tape having optical energy-markable properties to at least a portion of the surface of the packaged semiconductor device;
• subsequently exposing at least a portion of the tape to optical energy;
• and
• forming a mark.