Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
AssigneesSamsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
InventorRandall J. Lujan
Life of this patent
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Abstract
An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first drive shaft. The off-line tool further comprises a mechanical drive assembly for holding a second drive shaft in a position proximate the first surface of the platen and a first break-in head removably attached to the second drive shaft. The first break-in head receives a first pad conditioning disk and the second drive shaft moves the first break-in head toward the platen, thereby pressing the first pad conditioning disk against the polishing pad on the platen.
Claims23
An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system, said off-line tool comprising:
- a platen having a first surface for mounting a polishing pad thereon;
- a motor for rotating said polishing pad, wherein said motor is coupled to said platen via a first drive shaft associated with a mechanical drive assembly;
- said mechanical drive assembly capable of holding a second drive shaft in a position proximate said first surface of said platen;
- and
- a first break-in head capable of being removably attached to said second drive shaft, wherein said first break-in head is adapted to receive a first pad conditioning disk, and wherein said second drive shaft is operable to move said first break-in head toward said platen, thereby pressing said first pad conditioning disk against said polishing pad mounted on said first surface of said platen.
A method of breaking in a pad conditioning disk for a chemical mechanical polishing (CMP) system using an off-line tool comprising:
- i) a platen having a first surface for mounting a polishing pad thereon;
- ii) a motor for rotating the polishing pad, wherein the motor is coupled to the platen via a first drive shaft associated with a mechanical drive assembly;
- and iii) said mechanical drive assembly capable of holding a second drive shaft in a position proximate the first surface of the platen, the method comprising the steps of:
- removably attaching a break-in head to the second drive shaft;
- mounting the pad conditioning disk on the break-in head;
- moving the second drive shaft such that the break-in head is moved toward the platen, thereby pressing the pad conditioning disk against the polishing pad mounted on the first surface of the platen.
Dependencies are inferred from the claim text.