Electrical contacts with dielectric cores
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, William M. Hiatt, Charles M. Watkins
Life of this patent
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Abstract
An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core and a conductive coating on at least a portion thereof. Alternatively, an electrical contact may include a plurality of adjacent, mutually adhered regions comprising conductive material. The electrical contact may be rigid or flexible and resilient. Protective structures for use with flexible resilient contacts prevent deformation of such contacts beyond their elastic limits.
Claims60
A contact for a semiconductor device component, comprising:
- a core comprising a polymer and configured to protrude from the semiconductor device component in a generally transverse orientation relative to a plane of the semiconductor device component;
- and
- a conductive coating on at least a portion of the core.
A contact for a semiconductor device component, comprising:
- a core comprising a filament comprising dielectric material and configured to protrude from the semiconductor device component in a generally transverse orientation relative to a plane of the semiconductor device component;
- and
- a conductive coating on at least a portion of the core.
A contact for a semiconductor device component, comprising:
- a core comprising a dielectric material configured to be secured to and protrude from a contact pad of the semiconductor device component;
- and
- a conductive coating on at least a portion of the core.
Dependencies are inferred from the claim text.