Seal member limiting solder flow

An intercoupling component used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate, the intercoupling component comprising:

• A first insulative support member having a first upper surface and an opposite first lower surface, the first insulative support member including an array of first holes extending transversely from the first upper surface to the opposite first lower surface, the array of first holes located in a pattern corresponding to the array of the electrical connection regions of the first substrate;
• a plurality of electrically conductive terminal elements, disposed within the first holes and configured to electrically connect the array of connection regions of the first substrate to the array of connection regions of the second substrate;
• a second insulative support member having a second upper surface, an opposite second lower surface and a first stiffness characteristic, the second insulative support member including an array of second holes extending transversely from the second upper surface to the opposite second lower surface, the array of second holes receiving the plurality of electrically conductive terminal elements;
• and
• a seal member positioned between the first insulative support member and the second insulative member, the seal member having a third upper surface, an opposite third lower surface and a second stiffness characteristic less than the first stiffness characteristic of the second insulative support member, the seal member including an array of third holes extending transversely from the third upper surface to the opposite third lower surface, the array of third holes receiving the plurality of electrically conductive terminal elements and sized and shaped to restrict fluid flow along the terminal elements.