Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

An electrical component, comprising:

• at least one IC device having a plurality of lead elements extending therefrom;
• a substrate having a first surface and an opposing second surface;
• a plurality of apertures opening onto at least the first surface of the substrate and arranged in a pattern corresponding to a footprint of the plurality of lead elements extending from the at least one IC device, each aperture of the plurality of apertures comprising:
• a seat portion comprising a generally conically shaped recess having a maximum lateral dimension in the first surface;
• and
• a retaining portion comprising a via of a lateral dimension lesser than the maximum lateral dimension of the seat portion, the via extending from the seat portion toward the second surface of the substrate;
• a plurality of spring contacts, each spring contact of the plurality of spring contacts including a base portion and a contact portion, the contact portion comprising a generally cylindrically shaped resiliently compressible coil spring having a lateral dimension greater than the lateral dimension of the via, and the base portion extending longitudinally therefrom, the contact portion of each spring contact being at least partially received within and supported by the seat portion of an aperture and the base portion thereof having a lesser lateral dimension extending into and secured entirely within the retaining portion of the aperture and electrically connected to the substrate;
• wherein the resiliently compressible coil spring of the contact portions of at least some of the spring contacts of the plurality of spring contacts are biased against and electrically contacting lead elements of the plurality of lead elements of the at least one IC device;
• and
• at least one clamping element securing the at least one IC device to the substrate and biasing each lead element of the plurality of lead elements of the at least one IC device against the contact portion of one spring contact of the plurality of spring contacts.

An electrical component, comprising:

• at least one IC device having a plurality of lead elements extending therefrom;
• a substrate having a first surface and an opposing second surface;
• a plurality of apertures opening onto at least the first surface of the substrate and arranged in a pattern corresponding to a footprint of the plurality of lead elements extending from the at least one IC device, each aperture of the plurality of apertures comprising:
• a seat portion comprising a generally cylindrically shaped recess having a lateral dimension in the first surface;
• and
• a retaining portion comprising a via of a lateral dimension lesser than the seat portion lateral dimension, the via extending from the seat portion toward the second surface of the substrate;
• a plurality of spring contacts, each spring contact of the plurality of spring contacts including a base portion and a contact portion, the contact portion comprising a generally cone shaped resiliently compressible coil spring having an apex configured for contacting the outer surface of a lead element of the plurality, a maximum lateral dimension of the contact portion greater than the lateral dimension of the via, the base portion extending longitudinally from the contact portion, the contact portion of each spring contact being at least partially received within and supported by the seat portion of an aperture and the base portion thereof extending into and secured entirely within the retaining portion of the aperture and electrically connected to the substrate;
• wherein the resiliently compressible coil spring of the contact portions of at least some of the spring contacts of the plurality of spring contacts are biased against and electrically contacting lead elements of the plurality of lead elements of the at least one IC device;
• and
• at least one clamping element securing the at least one IC device to the substrate and biasing each lead element of the plurality of lead elements of the at least one IC device against the contact portion of one spring contact of the plurality of spring contacts.