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US 7,094,063 B1Granted
High density interconnect
AssigneeAgilent Technologies, Inc.
InventorsBob J. Self, Donald M. Logelin, Robert H. Wardwell
Life of this patent
Estimating the term…
Abstract
An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.
Claims16
An interconnect comprising:
- a stiff layer having a plurality of holes extending there through;
- a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole;
- a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole;
- and
- signal paths formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.
2 more elements
An interconnect comprising:
- a stiff layer having a plurality of holes therein;
- a ground plane embedded in the stiff layer;
- a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over holes;
- a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned over holes;
- and
- signal paths embedded in the stiff layer connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.
3 more elements
An interconnect comprising:
- a stiff layer having a plurality of holes therein;
- a conductive coating bonded to the walls of each of the plurality of holes;
- a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over the holes;
- a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned over the holes forming a plurality of pairs of conductive bumps, each pair including one conductive bump on the first flexible layer and one conductive bump on the second conductive layer;
- a plurality of vias, each via being associated with a conductive bump and extending through a respective first or second flexible layer through the stiff layer, each via being positioned over the wall of the hole associated with the associated conductive bump;
- tracings on the first flexible layer connecting each conductive bump to an associated via;
- tracings oh the second flexible layer connecting each conductive bump to an associated via;
- and
- wherein the portions of the first and second flexible layers adjacent to the conductive bumps are displaced into the plurality of holes when the interconnect is sandwiched between two connectors.
6 more elements
An interconnect comprising:
- a stiff layer having a plurality of holes therein;
- a ground plane embedded in the stiff layer;
- a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over the holes;
- a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned over the holes forming a plurality of pairs of conductive bumps, each pair including one conductive bump on the first flexible layer and one conductive bump on the second conductive layer;
- a plurality of vias, each via extending from the first flexible layer through the stiff layer to the second flexible layer, each via being associated with a pair of conductive bumps;
- tracings on the first flexible layer connecting each conductive bump to an associated via;
- tracings on the second flexible layer connecting each conductive bump to an associated via;
- and
- wherein the portions of the first and second flexible layers adjacent to the conductive bumps are displaced into the plurality of holes when the interconnect is sandwiched between two connectors.
6 more elements
Dependencies are inferred from the claim text.