Printed circuit board with integral strain gage
AssigneeVishay Measurements Group, Inc.
InventorsThomas P. Kieffer, Robert B. Watson
Life of this patent
Estimating the term…
Abstract
An integral strain measurement layer for use in an assembly printed circuit board to provide for strain measurement on the printed circuit board. The strain measurement layer includes an insulating layer having a top surface and a bottom surface, a strain sensitive layer of metallic foil adhered to the top surface of the insulating layer for measuring strain associated with the printed circuit board, and a copper coating disposed on the strain sensitive layer of metallic foil.
Claims15
A layer for use in an assembly printed circuit board to provide for strain measurement on the printed circuit board, the layer comprising:
- an insulating layer having a top surface and a bottom surface;
- a strain sensitive layer of metallic foil adhered to the top surface of the insulating layer for measuring stain associated with the printed circuit board;
- a conductive coating disposed on the strain sensitive layer of metallic foil;
- wherein the strain sensitive layer is patterned to provide at least one strain gage feature;
- and
- wherein the conductive coating is patterned to provide at least one conductive feature for communicating with the printed circuit board.
A printed circuit board comprising:
- a plurality of layers;
- wherein at least one of the plurality of layers is a strain measurement layer adapted to provide for strain measurement of the printed circuit board;
- wherein the at least one strain measurement layer comprises:
- (a) an insulating layer having a top surface and a bottom surface;
- (b) a strain sensitive layer of metallic foil adhered to the top surface of the insulating layer for measuring strain associated with the printed circuit board;
- (c) a conductive coating disposed on the strain sensitive layer of metallic foil;
- (d) wherein the strain sensitive layer is patterned to form at least one strain gage feature.
A layer for integration into a printed circuit board comprised of a plurality of layers, the layer providing for strain measurement on the printed circuit board, the layer comprising:
- an insulating layer having a top surface and a bottom surface;
- a strain sensitive layer of metallic foil adhered to one of the top surface or bottom surface of the insulating layer for measuring strain associated with the printed circuit board;
- a conductive coating disposed on the strain sensitive layer of metallic foil;
- wherein the strain sensitive layer is patterned to provide at least one strain gage feature;
- wherein the conductive coating is patterned to provide at least one conductive feature electrically connected to a separate layer of the plurality of layers of the printed circuit board.
Dependencies are inferred from the claim text.