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US 7,094,060 B2Granted
Via providing multiple electrically conductive paths
AssigneeBroadcom Corporation
InventorTonglong Zhang
Life of this patent
Estimating the term…
Abstract
A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.
Claims25
A via in a circuit board, comprising:
- an opening based on substantially partially overlapping bores;
- and
- electrically conductive paths that are electrically isolated from each other provided in the opening.
A via in a circuit board, comprising:
- an opening based on substantially partially overlapping bores;
- and
- distinct electrically conductive paths provided in the opening, wherein the distinct electrically conductive paths are formed by at least one additional bore which removes electrically conductive material from intersecting portions of the substantially partially overlapping bores.
Dependencies are inferred from the claim text.