Apparatus for deforming resilient contact structures on semiconductor components

An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:

• a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
• a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures;
• and
• a second holder configured to hold the substrate proximate to the deformation block,
• the first holder, the second holder, or both the first holder and the second holder, movable in X, Y and Z directions.

An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:

• a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
• a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures;
• and
• a second holder configured to hold the substrate proximate to the deformation block,
• wherein the substrate comprises a semiconductor wafer and the component comprises a semiconductor die.

An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:

• a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
• a first holder movable in X, Y and Z directions configured to hold and move the deformation block to compress, bend or shape the resilient contact structures;
• and
• a second holder configured to hold the substrate proximate to the deformation block.

An apparatus for deforming resilient contact structures on a semiconductor component contained on a substrate comprising:

• a deformation block comprising a plurality of retention structures configured to compress, bend or shape the resilient contact structures;
• a first holder configured to hold and move the deformation block to compress, bend or shape the resilient contact structures;
• and
• a second holder movable in X, Y and Z directions configured to hold the substrate proximate to the deformation block.

An apparatus for deforming resilient contact structures on a semiconductor die on a wafer comprising:

• a deformation block comprising a plurality of retention structures configured to physically engage and retain the resilient contact structures;
• a first holder configured to hold the deformation block;
• and
• a second holder configured to hold the wafer proximate to the deformation block;
• with either the first holder, the second holder, or both, movable in X, Y and Z directions such that the deformation block can compress, bend or shape the resilient contact structures.