US 7,093,493 B2 · Pressure sensor having a silicon chip on a steel diaphragm

Abstract

A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.

Claims19

Dependent claims

A micromechanical device for measuring a pressure variable, comprising:

a first component including a first diaphragm made of a first material;
and
a second component made of a second material, the second component including a first region and a second region, the first region having a thinner design compared to the second region, the first diaphragm and at least a portion of the first region being permanently joined together, the first material having a higher temperature expansion coefficient compared to the second material;
wherein:
the first diaphragm made of the first material transfers a lateral expansion to the first region of the second component as a function of the temperature.

2 more elements

A method for manufacturing a micromechanical pressure sensor, comprising:

providing a first component including a first diaphragm made of a first material;
providing a second component made of a second material, the second component including a first region and a second region, the first region having a thinner design compared to the second region;
and
joining together the first component and the second component in such a manner that the first diaphragm and at least one portion of the first region are permanently joined together;
wherein the first material has a higher temperature expansion coefficient compared to the second material, and the first diaphragm transfers a lateral expansion to the first region of the second component as a function of temperature, the transfer of the lateral expansion taking place via a first joining material between the first diaphragm and the at least one portion of the first region.

2 more elements

Dependencies are inferred from the claim text.

Pressure sensor having a silicon chip on a steel diaphragm

Life of this patent

Pressure sensor having a silicon chip on a steel diaphragm

Life of this patent

Abstract

Claims19