Apparatus and method for utilizing a meniscus in substrate processing
AssigneeLam Research Corporation
InventorRobert J. O'Donnell
Life of this patent
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Abstract
An apparatus for processing a substrate is provided which includes a proximity head proximate to a surface of the substrate when in operation. The apparatus also includes an opening on a surface of the proximity head to a cavity defined in the proximity head where the cavity delivers an active agent to the surface of the substrate through the opening. The apparatus further includes a plurality of conduits on the surface of the proximity head that generates a fluid meniscus on the surface of the substrate surrounding the opening.
Claims15
An apparatus for processing a substrate, comprising:
- a proximity head configured to be proximate to a surface of the substrate when in operation;
- an opening on a surface of the proximity head to a cavity defined in the proximity head, the cavity being configured to deliver an active agent to the surface of the substrate through the opening;
- and
- a plurality of conduits on the surface of the proximity head configured to generate a fluid meniscus on the surface of the substrate surrounding the opening.
A proximity head for processing a substrate, comprising:
- at least one first conduit defined within the proximity head, the at least one first conduit configured to apply a fluid to a surface of the substrate;
- and
- at least one second conduit defined within the proximity head, the at least one second conduit being in close proximity to the at least one first conduit, the at least one second conduit being configured to siphon the fluid from the surface of the wafer;
- wherein application of the fluid to the surface of the substrate and siphoning of the fluid from the surface of the substrate generates a fluid meniscus.
Dependencies are inferred from the claim text.