Method for manufacturing an electronic component

A method for manufacturing an electronic component, comprising the steps of:

• preparing a pair of substantially round conductive wires defining a pair of lead terminals;
• bending one end portion of each of the pair of conductive wires outwards at an angle of about 90 degrees;
• forming a flat portion on each of the pair of substantially round conductive wires by press extending at least the portion on a tip side from the bending point so as to be extended substantially parallel to a lead portion of a respective one of the pair of lead terminals, such that a thickness of the flat portion is less than a diameter of each of the pair of substantially round conductive wires;
• forming a cup-shaped holder portion by bending the flat portion inward;
• holding both end portions of a piezoelectric element in a pair of the cup-shaped holder portions;
• and
• electrically and mechanically connecting the cup-shaped holder portions and the electrodes formed in both end portions of the piezoelectric element by using a conductive joining material.