Method of making a center bond flip chip semiconductor carrier
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.
Claims24
A method for making a carrier for a semiconductor device, said method comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure;
- and
- providing an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die,
- wherein said forming a seat with a cut out portion comprises extending the cut out portion to the at least one trace located on the substrate.
A method for making a carrier for a semiconductor device, said method comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure;
- and
- providing an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die,
- wherein said forming a seat with a cut out portion comprises extending the cut out portion into the substrate.
A method of making a semiconductor device comprising:
- assembling a carrier, said assembling comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure, and
- positioning an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die;
- and
- electrically connecting said carrier with the semiconductor die,
- wherein said forming a seat with a cut out portion comprises extending the cut out portion into the substrate.
A method of making a semiconductor device comprising:
- assembling a carrier, said assembling comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure, and
- positioning an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die;
- and
- electrically connecting said carrier with the semiconductor die,
- wherein said forming a seat with a cut out portion comprises extending the cut out portion to the at least one trace located on the substrate.
Dependencies are inferred from the claim text.