Printed circuit board and method for installing printed circuit board onto electro-conductive housing

A method for installing a multi-layer printed circuit board on an electro-conductive housing, said multi-layer printed circuit, on which electronic parts are mounted, comprising a first signal layer formed on an obverse surface of said multi-layer printed circuit board, a ground layer arranged at a position next to said first signal layer, an electronic power source layer arranged at a position next to said ground layer, and a second signal layer formed on a reverse surface of said multi-layer printed circuit board, said method comprising the steps of:

• forming a first ground pattern around a peripheral area of said first signal layer;
• forming a second ground pattern around a peripheral area of said second signal layer;
• coupling electrically said first ground pattern to said second ground pattern with a plurality of through holes;
• coupling a snubber circuit, being a serial connection of a resistor and a capacitor, between said ground layer and said electronic power source layer;
• and
• mounting said multi-layer printed circuit board on a mounting area of said electro-conductive housing in such a manner that a substantially whole area of said second ground pattern electrically contacts said mounting area of said electro-conductive housing, said mounting area being an electro-conductive area continuously coupled to said electro-conductive housing.

A method for installing a multi-layer printed circuit board on an electro-conductive housing, said multi-layer printed circuit, on which electronic parts are mounted, comprising a first signal layer formed on an obverse surface of said multi-layer printed circuit board, a ground layer arranged at a position next to said first signal layer, an electronic power source layer arranged at a position next to said ground layer, and a second signal layer formed on a reverse surface of said multi-layer printed circuit board, said method comprising the steps of:

• forming a first ground pattern around a peripheral area of said first signal layer;
• forming a second ground pattern around a peripheral area of said second signal layer;
• coupling electrically said first ground pattern to said second ground pattern with a plurality of through holes;
• coupling a snubber circuit, being a serial connection of a resistor and a capacitor, between said ground layer and said electronic power source layer, and
• mounting said multi-layer printed circuit board on a mounting area of said electro-conductive housing in such a manner that a substantially whole area of said first ground pattern is electrically coupled to said electro-conductive housing through an electro-conductive member.