Method of accommodating in volume expansion during solder reflow

In a method of fabricating electronic devices wherein reflow of encapsulated solder occurs, comprising:

• forming a volume expansion region adjacent to said encapsulated solder having volume dimensions sufficient to accommodate enough of the volume expansion of said encapsulated solder during reflow so as to prevent damage, said volume expansion region including an air-cushioned diaphragm that flexes during volume expansion of said solder;
• and
• applying heat to said encapsulated solder to cause solder reflow to the liquid phase and expand into said volume expansion region and wherein during cooling the said solder that expanded into said volume expansion region is drawn-back to its original encapsulated site.