Lead frame structure with aperture or groove for flip chip in a leaded molded package
AssigneeFairchild Semiconductor Corporation
InventorsRajeev Joshi, Chung-Lin Wu
Life of this patent
Estimating the term…
Abstract
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach region. The die attach region includes one or more apertures. A molding material is around at least portions of the die attach region of the leadframe structure and the semiconductor die. The molding material is also within the one or more apertures.
Claims17
A semiconductor die package comprising:
- a semiconductor die including a first surface and a second surface;
- a leadframe structure comprising a die attach region and a plurality of leads extending away from the die attach region, wherein the die attach region is attached to the first surface of the semiconductor die and includes at least two apertures extending through the die attach region and being oriented generally perpendicular to the orientations of the leads in the plurality of leads, and wherein the semiconductor die is mounted on and overlaps with the at least two apertures in the die attach region of the leadframe structure;
- a molding material that is around at least portions of the die attach region of the leadframe structure and the semiconductor die, and wherein the molding material is also within the at least two apertures in the die attach region of the lead frame structure;
- and
- a conductive clip attached to the second surface of the semiconductor die.
The semiconductor die package comprising:
- (a) a semiconductor die including a first surface and a second surface;
- (b) a leadframe structure comprising a die attach region and a plurality of leads extending away from the die attach region, wherein the die region includes one or more apertures extending through the die attach region and being oriented generally perpendicular to the orientations of the leads in the plurality of leads, and wherein the semiconductor die is mounted on the die attach region of the leadframe structure;
- (c) a molding material that is around at least portions of the die attach region of the leadframe structure and the semiconductor die, and wherein the molding material is also within the one or more apertures in the die attach region of the lead frame structure;
- and
- wherein the lead frame structure includes a source lead structure, a gate lead structure, and a dummy lead structure.
A method for forming a semiconductor die package, the method comprising:
- (a) attaching a semiconductor die including a first surface and a second surface to a die attach region in a leadframe structure using solder, the leadframe structure comprising at least two apertures extending through the die attach region and a plurality of leads extending away from the die attach region, wherein the semiconductor die over laps with the at least two apertures in the die attach region and wherein the at least two apertures are oriented generally perpendicular to the orientations of the leads in the plurality of leads;
- (b) molding a molding material at least partially around the semiconductor die and the die attach region, wherein the molding material passes into the at least two apertures in the die attach region of the leadframe structure;
- and
- (c) attaching a conductive clip to the second surface of the semiconductor die.
Dependencies are inferred from the claim text.