# US 7,079,741 B2 · Optical interconnection circuit board and manufacturing method thereof

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- Number: US 7,079,741 B2
- Document ID: US7079741B2
- Status: Granted
- Kind: B2
- Application number: 11/143,731
- Filed: 2005-06-03
- Published: 2005-10-13
- Granted: 2006-07-18
- Earliest claimed: 2000-09-29
- Assignees: Kabushiki Kaisha Toshiba
- Inventors: Hideto Furuyama
- Web page: https://patentgrep.com/patent/US7079741B2

## CPC

- G02B 6/125: Bends, branchings or intersections
- G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
- G02B 6/42: Coupling light guides with opto-electronic elements
- G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)}
- G02B 2006/12069: {Organic material}
- G02B 2006/12104: {Mirror; Reflectors or the like}
- G02B 2006/12176: {Etching}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

In an optical connection board, a first clad layer is formed on a flat surface of a substrate and a core layer is formed on the first clad layer and is extended in a propagation direction of an optical signal. The core layer is covered with a second clad layer. A termination mirror having a reflection face is so buried in the clad layer as to reflect the optical signal guided in the core layer, to the outside of the optical connection board.

## Claims

### Claim 1

An optical interconnection circuit board for changing an optical path of an optical signal, comprising:
a substrate having a surface;
a first clad layer being a flat surface, which is formed on the surface of the substrate;
a first core segment configured to guide the optical signal in a first predetermined direction, formed on the flat surface of the first clad layer and extended in the first predetermined direction;
a second core segment configured to guide the optical signal in a second predetermined direction, different from the first predetermined direction, formed on the flat surface of the first clad layer and extended in the second predetermined direction;
an optical coupling mirror configured to optically couple the first core segment to the second core segment, the optical signal guided in the first core segment being reflected from the optical coupling mirror, the optical coupling mirror being formed on the flat surface of the first clad layer and contacted to the first and second core segments, and extending in a third predetermined direction different from the first and second directions;
a second clad layer formed on the first and second core segments and the optical coupling mirror; and
a reflection layer formed on the second clad layer, configured to reflect the optical signal from the optical coupling mirror and redirect the optical signal to the optical coupling mirror through the second clad layer, the redirected optical signal being reflected from the optical coupling mirror into the second core segment and propagated in the second core segment.

### Claim 2 (depends on 1)

The optical interconnection circuit board according to claim 1, wherein the optical coupling mirror has a reflection face inclined at a predetermined angle to the first and second predetermined directions and the first and second core segments are so extended as to cross each other.

### Claim 3

A method of manufacturing an optical interconnection circuit board for guiding an optical signal, comprising:
preparing a substrate having a surface;
forming a first clad layer having a flat surface, on the surface of the substrate;
forming a mirror layer on the first clad layer;
etching the mirror layer to form a mirror segment having a reflection face thereon and having a first height;
forming a first core segment on the first clad layer, the core segment having a second height not greater than the first height and being so extended as to have a predetermined optical circuit pattern;
covering the first core segment with a second clad layer; and
forming a reflection layer on the second clad layer.

### Claim 4 (depends on 3)

The method according to claim 3, further comprising:
forming a cover layer on the reflection layer, the cover layer having a coupling hole configured to allow the optical signal to pass therethrough; and
etching the reflection layer under the coupling hole of the cover layer to form a coupling portion configured to align the optical interconnection circuit board with an optical unit.

### Claim 5 (depends on 3)

The method according to claim 3, wherein the first core segment is extended in a first direction and the forming the first core segment further includes forming a second core segment on the first clad layer, the second core segment having the second height not greater than the first height and being so extended in a second direction different from the first direction as to have the predetermined optical circuit pattern.

### Claim 6 (depends on 5)

The method according to claim 5, wherein the mirror is contacted to the first and second core segments and extended in a third direction different from the first and second directions, the optical signal guided in the first core segment being reflected from the mirror and directed to the reflection layer, and the optical signal reflected from the reflection layer being directed to the second core segment and guided in the second core segment.

### Claim 7

A method of manufacturing an optical interconnection circuit board for guiding an optical signal, comprising:
preparing a substrate having a surface;
forming a first clad layer having a flat surface, on the surface of the substrate;
forming a mask layer on the first clad layer, the mask layer having an opening region;
depositing a mirror layer on the first clad layer under the opening region of the mask layer to form a mirror on the first clad layer, the mirror having a reflection face thereon and having a first height;
forming a first core segment on the first clad layer, the first core segment having a second height not greater than the first height and being so extended as to have a predetermined optical circuit pattern;
covering the first core segment with a second clad layer; and
forming a reflection layer on the second clad layer.

### Claim 8 (depends on 7)

The method according to claim 7, further comprising:
forming a cover layer on the relection layer, the cover layer having a coupling hole configured to allow the optical signal to pass therethrough; and
etching the reflection layer under the coupling hole of the cover layer to form a coupling portion configured to align the optical interconnection circuit board with an optical unit.

### Claim 9 (depends on 7)

The method according to claim 7, wherein the first core segment is extended in a first direction and the forming the first core segment further includes forming a second core segment on the first clad layer, the second core segment having the second height not greater than the first height and being so extended in a second direction different from the first direction as to have the predetermined optical circuit pattern.

### Claim 10 (depends on 9)

The method according to claim 9, wherein the mirror is contacted to the first and second core segments and extended in a third direction different from the first and second directions, the optical signal guided in the first core segment being reflected from the mirror and directed to the reflection layer, and the optical signal reflected from the reflection layer being directed to the second core segment and guided in the second core segment.