# US 7,079,373 B2 · Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit

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- Number: US 7,079,373 B2
- Document ID: US7079373B2
- Status: Granted
- Kind: B2
- Application number: 10/837,461
- Filed: 2004-04-30
- Published: 2005-11-03
- Granted: 2006-07-18
- Earliest claimed: 2004-04-30
- Assignees: Motorola, Inc.
- Inventors: Gregory J. Dunn; Jeffrey M. Petsinger; Jovica Savic
- Web page: https://patentgrep.com/patent/US7079373B2

## CPC

- H05K 3/0023: {by exposure and development of a photosensitive insulating layer}
- H05K 1/162: {incorporating printed capacitors}
- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- H05K 3/064: {Photoresists}
- H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
- H05K 2201/0175: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
- H05K 2201/0355: Metal foils
- H05K 2201/09309: Core having two or more power planes; Capacitive laminate of two power planes
- H05K 2203/0571: Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.

## Claims

### Claim 1

A dielectric sheet, comprising:
a photodielectric support layer; and
a dielectric laminate, comprising
first and second metal foil layers, and
a dielectric layer disposed between the first and second metal foil layers, wherein the
first metal foil layer is adhered to the photodielectric support layer, and wherein the
photodielectric support layer is a glass reinforced photodielectric layer.

### Claim 2 (depends on 1)

The dielectric sheet according to claim 1, wherein the dielectric layer comprises a crystallized dielectric oxide layer less than 1 micron thick.

### Claim 3 (depends on 2)

The dielectric sheet according to claim 2, wherein the dielectric layer comprises a crystallized lead calcium zirconate titanate material having a capacitive density of greater than 1000 pF/mm2.

### Claim 4 (depends on 2)

The dielectric sheet according to claim 2, wherein the crystallized dielectric oxide layer is formed from a dielectric oxide that contains lead.

### Claim 5 (depends on 1)

The dielectric sheet according to claim 1, wherein the dielectric layer comprises a polymer material filled with ceramic dielectric having a capacitive density of greater than 3 pF/mm2.

### Claim 6 (depends on 1)

The dielectric sheet according to claim 1, wherein: the first and second metal foil layers are each between 5 and 25 microns thick; and the photodielectric support layer is less than 260 microns thick.

### Claim 7 (depends on 1)

The dielectric sheet according to claim 1, wherein the first and second metal foil layers each comprise a metal selected from a group consisting of copper, copper alloys, nickel, and nickel alloys.

### Claim 8 (depends on 1)

The dielectric sheet according to claim 1, further comprising a second photodielectric support layer comprising polymer material that is adhered to the second metal foil layer.

### Claim 9

A printed circuit structure, comprising:
a dielectric sheet, comprising
a photodielectric support layer that is glass reinforced, and
a capacitive laminate, comprising
first and second metal foil layers, and
a dielectric layer disposed between the first and second metal foil layers, wherein the first metal foil layer is adhered to the photodielectric support layer; and a printed circuit sub-structure.

### Claim 10 (depends on 9)

The printed circuit structure according to claim 9, wherein the first metal foil layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.

### Claim 11 (depends on 9)

The capacitive sheet according to claim 9, wherein the dielectric layer comprises a crystallized dielectric oxide layer less than 1 micron thick.

### Claim 12 (depends on 9)

The printed circuit structure according to claim 9, further comprising at least one electronic component electrically connected to a portion of at least one of the first and second metal foil layers.