# US 7,078,789 B2 · Method of forming a metal film, semiconductor device and wiring board

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- Number: US 7,078,789 B2
- Document ID: US7078789B2
- Status: Granted
- Kind: B2
- Application number: 10/732,259
- Filed: 2003-12-11
- Published: 2004-06-24
- Granted: 2006-07-18
- Earliest claimed: 2002-12-12
- Assignees: Shinko Electric Industries Co., Ltd.
- Inventors: Masaaki Yoshitani
- Web page: https://patentgrep.com/patent/US7078789B2

## CPC

- C23C 18/30: Activating {or accelerating or sensitising with palladium or other noble metal}
- C23C 18/1608: {from pretreatment step, i.e. selective pre-treatment}
- C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
- C23C 18/1667: {Radiant energy, e.g. laser}
- C23C 18/204: {Radiation, e.g. UV, laser}
- C23C 18/32: Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence)
- C23C 18/38: Coating with copper
- H05K 3/181: {by electroless plating (adhesives therefor H05K3/387)}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method of forming a metal film on the surface of a resin substrate by forming plating nuclei on a resin substrate through a step of catalyzing treatment, a step of accelerating treatment and, then, a step of electrolytic copper plating treatment. Ultraviolet light is irradiated when there exist, in a mixed manner, portions exposing the surface of the resin substrate and the metal copper film formed by the electroless copper plating, to enhance the adhesion between the surface of the resin and the metal copper film. A step of ultraviolet light irradiation treatment is conducted after a step of electroless copper plating treatment. This is followed by an additional step of electroless copper plating treatment.

## Claims

### Claim 1

A method of forming a metal film on a resin substrate surface, comprising, in succession:
forming plating nuclei on said resin substrate surface;
electroless plating said plating nuclei with a metal covering said plating nuclei, as a first surface, portions of the resin substrate surface remaining exposed, as a second surface;
after said electroless plating, irradiating both said first surface and said second surface with ultraviolet light; and
electrolytic plating metal on said first and second surfaces to form a continuous metal film surface.

### Claim 2 (depends on 1)

A method of forming a metal film according to claim 1, wherein further electroless plating is effected on said first and second surfaces after said irradiating with ultraviolet light and before said electrolytic plating.

### Claim 3 (depends on 1)

A method of forming a metal film according to claim 1, wherein said ultraviolet light is irradiated through a glass board placed on said resin substrate surface.

### Claim 4 (depends on 3)

A method of forming a metal film according to claim 3, wherein the metal formed by said electroless plating is a selected one of copper and nickel.