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US 7,072,201 B2Granted
Memory module
AssigneeSamsung Electronics Co., Ltd.
InventorsByung-se So, Jeong-hyeon Cho, Jung-joon Lee, Jae-jun Lee
Life of this patent
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Abstract
In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is for buffering signals for memory chips on at least two circuit boards in the memory module.
Claims21
A memory module, comprising:
- at least first and second circuit boards opposing one another such that the first and second circuit boards have inner faces facing each other and outer faces facing away from each other, the first circuit board including a connecting portion for connecting the memory module to a mother board;
- at least one of the inner and outer faces of the first circuit board supporting a first plurality of memory chips;
- at least one of the inner and outer faces of the second circuit board supporting a second plurality of memory chips;
- an electrical connector electrically connecting the first and second circuit boards;
- and
- a single buffer, disposed on only the first circuit board, for buffering signals for the first and second plurality of memory chips.
3 more elements
A memory module, comprising:
- a first circuit board;
- a second circuit board;
- a first plurality of memory chips disposed on the first circuit board;
- a second plurality of memory chips disposed on the second circuit board;
- an electrical connector electrically connecting the first and second circuit boards;
- and
- a buffer disposed on only one of the first and second circuit boards, electrically connected to the electrical connector and buffering signals for the first and second plurality of memory chips.
4 more elements
A memory structure, comprising:
- a stacked memory module having more than one circuit board supporting memory chips, the circuit boards being electrically connected;
- and
- a buffer disposed on only one of the circuit boards for buffering signals for the memory chips on more than one of the circuit boards.
A stacked memory module, comprising:
- a buffer disposed on only one of at least two circuit boards in the memory module, the buffer for buffering signals for memory chips on at least two circuit boards in the memory module.
A memory module, comprising:
- at least first and second circuit boards opposing one another such that the first and second circuit boards have inner faces facing each other and outer faces facing away from each other, the first circuit board including a connecting portion for connecting the memory module to a mother board;
- at least one of the inner and outer faces of the first circuit board supporting a first plurality of memory chips;
- at least one of the inner and outer faces of the second circuit board supporting a second plurality of memory chips;
- an electrical connector electrically connecting the first and second circuit boards;
- a buffer disposed on the first circuit board, the buffer for buffering signals for the first and second plurality of memory chips;
- and
- a register electrically connected with the buffer for buffering command and address signals for the second plurality of memory chips, and the register and the buffer positioned on opposite faces of the first circuit board.
4 more elements
Dependencies are inferred from the claim text.