Via adhesion in multilayer MEMS structure
AssigneeTexas Instruments Incorporated
InventorRabah Mezenner
Life of this patent
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Abstract
A method of fabricating improved vias in a multilayer MEMS device. Via seats are patterned into first layer, such that each via will have a via seat at the bottom of the via opening. The via openings are then patterned into a second layer. A third layer of material is deposited, such that the material at least partly fills the via opening and the via seat. The material forms a support post that is anchored to the first layer by means of the material in the via seat.
Claims16
An array of micromirror pixels, comprising:
- a mirror layer having a mirror associated with each pixel;
- a hinge layer spaced under the mirror layer, the hinge layer having a hinge under each mirror and attached to the mirror such that the mirror may tilt above the hinge layer;
- an address layer spaced under the hinge layer, the address layer having circuitry for controlling operation of the pixels;
- and
- wherein each mirror is connected to the hinge layer with a via support post, the via support post being made from a material that at least partly fills a via opening and a via seat patterned into the hinge layer.
A multilayer MEMS structure having an improved via, the via comprising:
- a support post formed by patterning a via seat in a first layer and a via opening in a second layer, and by depositing material over the second layer, such that the material enters the via and fills or coats the via opening and the via seat.
A method of forming a via in a multilayer MEMS structure, comprising the steps of:
- patterning via seats into a first layer;
- patterning via openings into a second layer;
- and
- depositing material over the second layer such that the material at enters the via opening and at least partly fills the via seat and the via opening.
A method of forming a micromirror array, comprising the steps of:
- forming control circuitry on a semiconductor substrate;
- depositing a first spacer layer on the substrate;
- patterning the first spacer layer to define hinge support vias and spring tip support vias;
- depositing a hinge layer over the first spacer layer;
- forming at least one hinge etch mask on the hinge layer;
- patterning the hinge layer to form at least one hinge and at least one via seat on the hinge;
- depositing a second spacer layer over the hinge layer;
- patterning the second spacer layer to define mirror via openings;
- depositing a metal mirror material over the second spacer layer, such that the mirror material at least partly fills the via seats and the via openings;
- patterning the metal mirror layer to form an array of micromirrors;
- and
- removing the first and the second spacer layers.
Dependencies are inferred from the claim text.