Systems and methods for inspection of specimen surfaces

A system configured to inspect a specimen, comprising:

• a contact image sensor spaced above a surface of the specimen such that a rod lens array is spaced above the surface of the specimen by less than approximately 10 mm, wherein the contact image sensor has a height of less than approximately 10 mm, the contact image sensor comprising:
• a light source configured to direct light toward the surface of the specimen;
• the rod lens array configured to collect light returned from the surface of the specimen, wherein a collection angle of each rod lens is substantially equal, and wherein the contact image sensor further comprises an optical configuration for telecentric collection of specimen images by the rod lens array;
• and
• a first sensor array configured to detect light collected by the rod lens array, wherein each rod lens is coupled to one sensor of the first sensor array;
• and
• a processing device coupled to the contact image sensor and configured to determine a presence of defects on the surface of the specimen using the specimen images.

A method for inspecting a specimen, comprising:

• directing light from a light source toward a surface of the specimen;
• collecting light returned from the surface of the specimen using a rod lens array, wherein each rod lens of the rod lens array has a diameter of approximately 10 microns, and wherein a collection angle of each rod lens is substantially equal;
• detecting the collected light using a first sensor array, wherein the light source, the rod lens array, and the first sensor array are arranged in a contact image sensor, wherein each rod lens is coupled to one sensor of the first sensor array, wherein the contact image sensor is spaced above the surface of the specimen such that the rod lens array is spaced above the surface of the specimen by less than approximately 10 mm, wherein the contact image sensor has a height of approximately 10 mm, and wherein the contact image sensor comprises an optical configuration for telecentric collection of specimen images by the rod lens array;
• and
• determining a presence of defects on the surface of the specimen from the specimen images.

A method for inspecting a specimen between two process steps, comprising:

• transporting the specimen from a first process chamber to a second process chamber;
• directing light from a light source toward a surface of the specimen during said transporting;
• collecting light returned from the surface of the specimen using a rod lens array during said transporting;
• detecting the collected light using a first sensor array during said transporting, wherein the light source, the rod lens array, and the first sensor array are arranged in a contact image sensor, wherein the contact image sensor is spaced above the surface of the specimen such that the rod lens array is spaced above the surface of the specimen by less than about 10 mm, wherein the collected light comprises specimen images, and wherein the contact image sensor comprises an optical configuration for telecentric collection of the specimen images by the rod lens array;
• and
• determining a presence of defects on the surface of the specimen from the specimen images.

A semiconductor device fabricated by a method, the method comprising:

• forming a portion of the semiconductor device upon a wafer;
• directing light from a light source toward a surface of the portion of the semiconductor device;
• collecting light returned from the surface of the portion of the semiconductor device using a rod lens array;
• detecting the collected light using a first sensor array, wherein the light source, the rod lens array, and the first sensor array are arranged in a contact image sensor, wherein the contact image sensor is spaced above the surface of the portion of the semiconductor device such that the rod lens array is spaced above the surface by less than about 10 mm, and wherein the contact image sensor comprises an optical configuration for telecentric collection of images of the wafer by the rod lens array;
• and
• determining a presence of defects on the surface of the portion of the semiconductor device from the images.

A method for fabricating a semiconductor device, comprising:

• forming a portion of the semiconductor device upon a wafer;
• directing light from a light source toward a surface of the portion of the semiconductor device;
• collecting light returned from the surface of the portion of the semiconductor device using a rod lens array;
• detecting the collected light using a first sensor array, wherein the light source, the rod lens array, and the first sensor array are arranged in a contact image sensor, wherein the contact image sensor is spaced above the surface of the portion of the semiconductor device such that the rod lens array is spaced above the surface by less than about 10 mm, and wherein the contact image sensor comprises an optical configuration for telecentric collection of images of the wafer by the rod lens array;
• and
• determining a presence of defects on the surface of the portion of the semiconductor device from the images.

A computer-implemented method for controlling a system configured to inspect a specimen, wherein the system comprises a contact image sensor, the method comprising:

• controlling the contact image sensor, wherein the contact image sensor comprises a light source, a rod lens array, and a first sensor array, comprising:
• controlling the light source to direct light toward a surface of the specimen;
• collecting light returned from the surface of the specimen using the rod lens array, wherein the contact image sensor is spaced above the surface of the specimen such that the rod lens array is spaced above the surface of the specimen by less than about 10 mm, wherein the collected light comprises specimen images, and wherein the contact image sensor further comprises an optical configuration for telecentric collection of the specimen images by the rod lens array;
• and
• controlling the first sensor array to detect the collected light;
• and
• processing the specimen images to determine a presence of defects on the surface of the specimen.

An apparatus for inspecting a substrate, comprising:

• a. a light source for illuminating at least a portion of said substrate;
• b. optics for collecting light from said illuminated portion, wherein the collected light comprises substrate images;
• c. a plurality of sensors for sensing said collected light;
• and
• d. a processor for determining the presence of a defect or process variation on said substrate, wherein said optics and said sensors and at least a portion of said light source are contained in an integrated package proximate to and spaced above said substrate, and wherein said optics and said sensors comprise an optical configuration for telecentric collection of the substrate images.

A method of inspecting a substrate, comprising:

• a. illuminating at least a portion of said substrate;
• b. collecting light from said portion, and transmitting said collected light to a plurality of sensors at approximately a 1:1 magnification, wherein the collected light comprises substrate images, and wherein said illuminating and said collecting is performed by a contact image sensor space above the substrate and comprising an optical configuration for telecentric collection of the substrate images;
• and
• c. processing data from said plurality of sensors to determine the existence of defects or process variations within said portion.