Exposure apparatus, method of controlling same, and method of manufacturing devices
AssigneeCanon Kabushiki Kaisha
InventorTakehiko Iwanaga
Life of this patent
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Abstract
A scanning exposure apparatus includes a projection optical system which projects a pattern formed on a mask onto an object, a stage which holds an object and moves in a direction perpendicular to an optical axis of the projection optical system, a measurement system which measures a position of a surface of the object in a direction of the optical axis in response to a reset signal, and a generation system which generates the reset signal when the stage arrives at each predetermined position in the direction perpendicular to the optical axis.
Claims10
A scanning exposure apparatus for performing an exposure of each region of a substrate to light via a reticle while the substrate and the reticle are scanned, said apparatus comprising:
- a projection optical system configured to project a pattern of the reticle onto the substrate;
- a stage configured to hold the substrate and to move in a direction of an optical axis of said projection optical system and in a scanning direction perpendicular to the optical axis;
- a surface position measurement system configured to measure a position of a surface of the substrate in the direction of the optical axis in response to a command;
- and
- a stage position measurement system, having a counter in which information of a plurality of positions of said stage in the scanning direction is preset with respect to each region, configured to measure a position of said stage in the scanning direction, and to generate the command if the measured position of said stage reaches each of the plurality of positions of which information is preset in said counter.
A scanning exposure apparatus for performing an exposure of each region of a substrate to light via a reticle while the substrate and the reticle are scanned, said apparatus comprising:
- a projection optical system configured to project a pattern of the reticle onto the substrate;
- a stage configured to hold the substrate and to move in a direction of an optical axis of said projection optical system and in a scanning direction perpendicular to the optical axis;
- a surface position measurement system configured to measure a position of a surface of the substrate in the direction of the optical axis in accordance with a command;
- a stage position measurement system configured to measure a position of said stage in the scanning direction;
- and
- a stage position control system configured to control a position of said stage, and to generate, as the command, a command including information of the measured position of said stage,
- wherein said surface position measurement system is configured to determine a time for measuring the position of the surface based on the information of the measured position of said stage included in the command and information regarding a velocity of said stage in the scanning direction.
A scanning exposure method of performing an exposure of each region of a substrate to light via a reticle while the substrate and the reticle are scanned, said method comprising steps of:
- presetting information of a plurality of positions of a stage in a scanning direction in a counter with respect to each region, the stage being configured to hold the substrate, the scanning direction being perpendicular to an optical axis of a projection optical system configured to project a pattern of the reticle onto the substrate;
- moving the stage in the scanning direction;
- measuring a position of the stage in the scanning direction;
- generating a command if the measured position of the stage reaches each of the plurality of positions of the stage of which information is preset in the counter;
- and
- measuring a position of a surface of the substrate in a direction of the optical axis in response to the command.
A scanning exposure method of performing an exposure of each region of a substrate to light via a reticle while the substrate and the reticle are scanned, said method comprising steps of:
- moving a stage in a scanning direction, the stage being configured to hold the substrate, the scanning direction being perpendicular to an optical axis of a projection optical system configured to project a pattern of the reticle onto the substrate;
- measuring a position of the stage in the scanning direction;
- generating a command including information of the measured position of the stage;
- and
- measuring a position of a surface of the substrate in a direction of the optical axis in accordance with the command,
- wherein said surface position measuring step determines a time for measuring the position of the surface based on the information of the measured position of the stage included in the command and information of a velocity of the stage in the scanning direction.
Dependencies are inferred from the claim text.