High impedance substrate
AssigneeCommissariat a l'Energie Atomique
InventorsOlivier Reynet, Olivier Acher, Marc Ledieu
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Abstract
A high-impedance substrate including a first layer made of insulating material, having a lower face and an upper face, the substrate including conductor patterns mechanically linked to the substrate. Some of the conductor patterns mechanically linked to the substrate are associated with a magnetic tile. At least one electrical interconnection puts two points distinct from one another of a conductor pattern mechanically linked to the substrate in electrical contact, this conductor pattern having an assigned magnetic tile, passing above the magnetic tile associated with the conductor pattern mechanically linked to the substrate.
Claims23
A high-impedance substrate comprising:
- a first layer or sheet made of insulating material, having a first face and a second face in a form of a lower face and an upper face;
- and
- conductor patterns mechanically linked to the substrate, wherein at least some of the conductor patterns mechanically linked to the substrate are associated with a magnetic tile placed on or above one of the first and second faces of the substrate, and at least one electrical interconnection puts two points in electrical contact distinct from one another of one of the conductor patterns mechanically linked to the substrate, this conductor pattern having an assigned magnetic tile, passing above the magnetic tile associated with the conductor pattern mechanically linked to the substrate.
Dependencies are inferred from the claim text.