Wafer probecard interface
AssigneeInfineon Technologies AG
InventorDavid Suitwai Ma
Life of this patent
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Abstract
Apparatus and method for testing a device wafer having a plurality of devices formed thereon. One embodiment of the invention provides an interface wafer comprising a plurality of contact pads disposed on a first surface for contacting a plurality of device pads on the device wafer and a plurality of interface pads disposed on a second surface for contacting probe needles on a probe card, wherein the plurality of interface pads are electrically connected to the plurality of contact pads and wherein the plurality of interface pads are disposed in a relaxed-pitch arrangement as compared to the plurality of contact pads.
Claims18
An apparatus for testing a device wafer having a plurality of devices formed thereon, comprising:
- an interface wafer having a first surface and a second surface, the interface wafer comprising:
- a plurality of contact pads disposed on the first surface for contacting a plurality of device pads on the device wafer;
- a plurality of interface pads disposed on the second surface for contacting probe needles on a probe card, wherein the plurality of interface pads are electrically connected to the plurality of contact pads;
- a first interconnect layer having one or more first interconnect lines, each interconnect line electrically connecting a respective first set of contact pads, wherein the first interconnect layer is disposed within the interface wafer;
- and
- a second interconnect layer, disposed within the interface wafer, having one or more second interconnect lines, each second interconnect line electrically connecting a respective second set of contact pads.
An apparatus for testing a device wafer, comprising:
- an interface wafer having a first surface and a second surface, the interface wafer comprising:
- a plurality of contact means, disposed on the first surface, for contacting a plurality of device pads on the device wafer;
- a plurality of interface means, disposed on the second surface, for contacting probe needles on a probe card;
- one or more first interconnect means, each electrically connecting a respective first set of contact means, wherein the one or more first interconnect means are disposed within the interface wafer;
- and
- one or more second interconnect means, disposed within the interface wafer, each electrically connecting a respective second set of contact means.
Dependencies are inferred from the claim text.