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US 7,071,719 B2Granted
Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTsunehiro Sato, Kiyotaka Hayashi
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes at least three circuit substrates laid one upon another. The device further includes first circuit elements mounted, respectively, on at least two of the three circuit substrates. It also includes a second circuit element mounted on one of the three circuit substrates and configured to change connection between the first circuit elements.
Claims10
A semiconductor device comprising:
- first, second and third circuit substrates which are stacked one upon another;
- a memory element mounted on the first circuit substrate;
- a memory controller mounted on the second circuit substrate, and electrically connected to the memory element;
- and
- a changeover circuit mounted on the third circuit substrate, receiving an input signal from an external device, and electrically connected to one of the memory element and the memory controller depending on operation modes having a first and a second modes,
- wherein, in the first mode, the changeover circuit supplies the input signal to the memory element by way of the memory controller, and in the second mode, the changeover circuit directly supplies the input signal to the memory element, without the input signal being supplied to the memory controller.
3 more elements
A semiconductor device comprising:
- a first circuit substrate;
- a first circuit element which is mounted on the first circuit substrate to receive an input signal from an external device;
- a second circuit substrate provided on the first circuit substrate;
- a second circuit element which is mounted on the second circuit substrate, connected to the first circuit element and different in type from the first circuit element;
- a third circuit substrate provided on the second circuit substrate;
- and
- a changeover circuit which is mounted on the third circuit substrate and changes the connection of the second circuit element and the first circuit element to the connection of the second circuit element and an external device,
- wherein, in a first mode, a signal output from the first circuit element is input to the second circuit element, and in a second mode, a signal output from the external device is input to the second circuit element.
5 more elements
Dependencies are inferred from the claim text.