Method and system for compensating for thermally induced motion of probe cards

An apparatus comprising:

• a probe card, wherein said probe card is part of an apparatus with a plurality of probes disnosed to contact an electronic device to be tested;
• an energy transmissive element disposed to transmit energy to said probe card to counteract thermally induced bowing of said probe card;
• and
• a temperature sensor disposed to monitor a temperature corresponding to said thermally induced bowing of said probe card.

An apparatus comprising:

• a probe card, wherein said probe card is part of an apparatus with a plurality of probes disposed to contact an electronic device to be tested, said probe card comprising a device side that faces said electronic device to be tested and a second side opposite said device side;
• and
• means for reducing a temperature gradient between said device side of said probe card and said second side of said probe card,
• wherein said means for reducing a temperature gradient is configured to affect independently a first temperature on said device side of said probe card and a second temperature on said second side of said probe card.

An apparatus comprising:

• a probe card, wherein said probe card is part of an apparatus with a plurality of probes disposed to contact an electronic device to be tested, said probe card comprising a device side that faces said electronic device to be tested and a second side opposite said device side;
• means for reducing a temperature gradient between said device side of said probe card and said second side of said probe card;
• and
• a temperature sensor disposed to monitor a temperature on said device side of said probe card.

An apparatus comprising:

• a probe card, wherein said probe card is part of an apparatus with a plurality of probes disposed to contact an electronic device to be tested, said probe card comprising a device side that faces said electronic device to be tested and a second side opposite said device side;
• and
• means for reducing a temperature gradient between said device side of said probe card and said second side of said probe card,
• wherein:
• said device side comprises a surface of said probe card that faces said device to be tested and said second side comprises a surface of said probe card that faces away from said device to be tested, and
• said means for reducing a temperature gradient farther selectively adjusts a temperature at at least one of said device surface and said second surface to reduce a difference between a temperature at said device surface and a temperature at said second surface.