Semiconductor device and resin binder for assembling semiconductor device
AssigneeMatshushita Electric Industrial Co., Ltd.
InventorsYoshiyuki Wada, Tadahiko Sakai
Life of this patent
Estimating the term…
Abstract
In a semiconductor device of a structure comprising a thin semiconductor element bonded to a reinforcing plate via a bonding layer of a predetermined thickness, resin binder used for forming the bonding layer contains fillers including a first filler, which has a diameter generally equal to a target thickness of the bonding layer to be adjusted to a value within a range of proper thickness (from 25 μm to 200 μm). This can maintain the bonding layer within the range of proper thickness when the semiconductor element is bonded to the plate, and ensure on-board mounting reliability of the semiconductor device.
Claims10
A semiconductor device to be mounted onto a circuit board, comprising:
- a semiconductor element having a thickness of at most 100 μm, said semiconductor element having a first surface bearing a terminal for external connection, and a second surface opposite said first surface;
- a bump on said terminal for external connection;
- a plate confronting said second surface;
- and
- a bonding layer between said second surface and said plate such that said semiconductor element is bonded to said plate via said bonding layer, said bonding layer having a thickness within a range of from 25 μm to 200 μm,
- wherein said bonding layer contains filler functioning as a spacer between said semiconductor element and said plate so as to provide said bonding layer with a predetermined thickness.
Dependencies are inferred from the claim text.