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US 7,071,576 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsHideo Nakayoshi, Chiaki Takubo
Life of this patent
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Abstract
A semiconductor device includes a semiconductor substrate, a first wiring arranged on the semiconductor substrate, a first electrode pad electrically connected to the first wiring, and a porous organic resin film covering the front surface of the semiconductor substrate such that the first electrode pad is exposed to the outside.
Claims20
A semiconductor device comprising:
- a semiconductor element having a front surface on which an electrode pad is provided, the front surface being covered with a porous organic resin film;
- an electrode electrically connected to the electrode pad;
- a package substrate having a mounting surface to which the semiconductor element is mounted such that the front surface of the semiconductor element is mounted to the package substrate;
- a package wiring arranged within the package substrate and electrically connected to the electrode;
- and
- a sealing section sealing a clearance between the organic resin film and the package substrate.
3 more elements
A semiconductor device comprising:
- a semiconductor element having a front surface on which an electrode pad is provided, the front surface being covered with a porous organic resin film;
- a package substrate having a mounting surface to which the semiconductor element is mounted such that a back surface opposite to the front surface of the semiconductor element is mounted to the package substrate;
- and
- a molding resin layer arranged on the package substrate so as to cover the semiconductor element,
- wherein the semiconductor element includes an interlayer insulating film having a dielectric constant lower than 3 and formed between a semiconductor substrate of the semiconductor element and the organic resin film.
2 more elements
A semiconductor device comprising:
- a semiconductor substrate which has terminals;
- a package which is provided on the substrate and which has a semiconductor element and electrode pads electrically connected to the terminals;
- and
- an organic resin film which is porous and which fills a gap between the substrate and the package.
1 more element
A semiconductor device comprising:
- a semiconductor element;
- a first wiring arranged on a front surface of the semiconductor element;
- a porous organic resin film covering the front surface of the semiconductor element;
- a second wiring arranged within the organic resin film and electrically connected to the first wiring;
- and
- an electrode arranged on the organic resin film and electrically connected to the second wiring.
3 more elements
Dependencies are inferred from the claim text.