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US 7,071,573 B1Granted
Semiconductor chip assembly with welded metal pillar
AssigneeBridge Semiconductor Corporation
InventorCharles W. C. Lin
Life of this patent
Estimating the term…
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.
Claims230
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and is not covered in the first direction by the encapsulant or any other insulative material of the assembly, and any chip embedded in the encapsulant is electrically connected to the metal pillar by an electrically conductive path that includes the routing line.
2 more elements
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, includes a ball bond that is metallurgically welded to the routing line, extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and is not covered in the first direction by the encapsulant or any other insulative material of the assembly, and any chip embedded in the encapsulant is electrically connected to the metal pillar by an electrically conductive path that includes the routing line.
2 more elements
A semiconductor chip assembly, comprising:
- a semiconductor chip that includes first and second opposing surfaces, wherein the first surface of the chip includes a conductive pad;
- a conductive trace that includes a routing line and a metal pillar;
- a connection joint that electrically connects the routing line and the pad;
- and
- an encapsulant that includes first and second opposing surfaces, wherein the first surface of encapsulant faces in a first direction, the second surface of the encapsulant faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the chip, the metal pillar and the encapsulant extend vertically beyond the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, the metal pillar is a ball bond that is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip and is not covered in the first direction by the encapsulant or any other insulative material of the assembly, and any chip embedded in the encapsulant is electrically connected to the metal pillar by an electrically conductive path that includes the routing line.
2 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- metallurgically welding a metal pillar to the routing line;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers the chip and extends vertically beyond the chip and the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically beyond the routing line in the first direction and extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip.
4 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- metallurgically welding a metal pillar to the routing line by ball bonding;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers the chip and extends vertically beyond the chip and the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically beyond the routing line in the first direction and extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip.
4 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- metallurgically welding a metal pillar to the routing line by ball bonding using thermocompression or thermosonic bonding;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers the chip and extends vertically beyond the chip and the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically beyond the routing line in the first direction and extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip.
4 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- metallurgically welding a metal pillar to the routing line by applying thermocompression or thermosonic bonding using a capillary that presses a wire ball against the routing line;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers the chip and extends vertically beyond the chip and the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically beyond the routing line in the first direction and extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip.
4 more elements
A method of making a semiconductor chip assembly, comprising:
- providing a routing line;
- then
- mechanically attaching a semiconductor chip to the routing line, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
- forming a connection joint that electrically connects the routing line and the pad;
- metallurgically welding a metal pillar to the routing line, including:
- positioning a capillary with a wire ball extending therefrom over the routing line, wherein the wire ball is connected to a wire that is fed through the capillary;
- moving the capillary towards the routing line so that the wire ball contacts the routing line and deforms into a ball bond and remains connected to the wire;
- and
- moving the capillary away from the routing line, disconnecting the ball bond from the wire, and cooling the ball bond so that the ball bond contacts and is welded to and electrically connected to the routing line;
- and
- forming an encapsulant after attaching the chip to the routing line and welding the metal pillar to the routing line, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the chip and the metal pillar are embedded in the encapsulant, the encapsulant covers the chip and extends vertically beyond the chip and the routing line in the first direction, the routing line extends laterally beyond the metal pillar towards the chip and extends vertically beyond the chip and the metal pillar in the second direction, and the metal pillar is disposed outside a periphery of the chip and any other chip embedded in the encapsulant, is metallurgically welded to and only to the routing line, extends vertically beyond the routing line in the first direction and extends vertically across most or all of a thickness of the chip between the first and second surfaces of the chip.
8 more elements
Dependencies are inferred from the claim text.