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US 7,071,572 B2Granted
Pre-back-grind and underfill layer for bumped wafers and dies
AssigneeIntel Corporation
InventorTakashi Kumamoto
Life of this patent
Estimating the term…
Abstract
Multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies, in which a planarizing coating provides improved and continued surface protection to the circuit surface of a wafer or die throughout back-grinding and subsequent mounting operations, and provides improved stiffening/strengthening of the wafer and die throughout back-grinding and subsequent mounting operations.
Claims23
An apparatus comprising:
- a pre-back-grind under-fill layer on a surface of a die or a wafer having a bump, wherein the pre-back-grind under-fill layer provides both substantially planar back-grind support during a back-grind process and under-fill material during a mounting/under-fill process, wherein the pre-back-grind under-fill layer entirely covers the bump.
A back-grind/mounting method useable with either one of a bumped-die or a bumped wafer comprising:
- providing a pre-back-grind under-fill layer on the bumped-die or bumped wafer to provide both substantially planar back-grind wafer support during a back-grind process and under-fill material during a mounting/under-fill process, wherein the pre-back-grind under-fill layer entirely covers a bump on the bumped-die or bumped wafer.
A method comprising:
- providing a coating over a surface of a substrate having a bump, wherein the coating entirely covers the bump;
- grinding the back-side of the substrate to form a thinned substrate, wherein the coating provides a planarizing support layer during grinding;
- and
- flip-chip mounting the thinned substrate to a second substrate having a flip-chip land, wherein the coating provides an underfill material during flip-chip mounting.
1 more element
Dependencies are inferred from the claim text.