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US 7,071,571 B2Granted
Semiconductor component having a plastic housing and methods for its production
AssigneeInfineon Technoloiges AG
InventorsJochen Dangelmaier, Horst Theuss
Life of this patent
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Abstract
The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.
Claims11
A semiconductor component comprising:
- a rewiring structure having flat conductors with an upper side and a rear side, the flat conductors further comprising portions of a metal sheet and being embedded in a layer of plastic;
- contact connecting pads arranged on the upper side of the flat conductors;
- flip-chip contacts of a semiconductor chip that are connected to the contact connecting pads;
- external contact pads that are arranged on the rear side of the flat conductors, and positioned with respect to the positions of the flip-chip contacts to have an offset that is bridged by the flat conductors;
- and
- a plastic housing enclosing the semiconductor chip and the flip-chip contacts;
- wherein the external contact pads and the contact connecting pads have an identical first metal alloy and the flat conductors have a different alloy from the first metal alloy.
4 more elements
A semiconductor component comprising:
- a rewiring structure, having elongated contact connecting pads covered by plastic, the elongated contact connecting pads further comprising portions of a metal sheet and having an upper side and a rear side;
- flip-chip contacts of a semiconductor chip arranged on the upper side of the elongated contact connecting pads;
- external contact pads that are arranged on the rear side of the elongated contact connecting pads and whose positions with respect to the positions of the flip-chip contacts have an offset that is bridged by the elongated contact connecting pads;
- and
- a plastic housing enclosing the semiconductor chip and the flip-chip contacts;
- wherein the external contact pads have first and second regions of different metal alloys that are layered above one another.
3 more elements
A carrier structure comprising:
- a plurality of component positions arranged in rows and in columns;
- a slotted metal sheet forming a flat lead frame between the component positions and a rewiring structure in the component positions;
- at least one semiconductor component in one of the component positions, the semiconductor component comprising:
- the rewiring structure, which comprises flat conductors having an upper side and a rear side, the flat conductors being embedded in a layer of plastic;
- contact connecting pads arranged on the upper side of the flat conductors;
- flip-chip contacts of a semiconductors chip being connected to the contact connecting pads;
- external contact pads that are arranged on the rear side of the flat conductors, whose positions with respect to the positions of the flip-chip contacts have an offset that is bridged by the flat conductors;
- and
- a plastic housing that encloses the semiconductor chip and the flip-chip contacts;
- wherein the external contact pads and the contact connecting pads have an identical first metal alloy and the flat conductors have a different alloy from the the first metal alloy.
7 more elements
A carrier structure comprising:
- a plurality of component positions arranged in rows and columns;
- a self-contained metal sheet on whose upper side rewiring structures are arranged in the component positions;
- at least one semiconductor component in one of the component positions, the semiconductor component comprising:
- the rewiring structure, which comprises flat conductors having an upper side and a rear side, the flat conductors being embedded in a layer of plastic;
- contact connecting pads arranged on the upper side of the flat conductors;
- flip-chip contacts of a semiconductors chip being connected to the contact connecting pads;
- external contact pads that are arranged on the rear side of the flat conductors, whose positions with respect to the positions of the flip-chip contacts have an offset that is bridged by the flat conductors;
- and
- a plastic housing that encloses the semiconductor chip and the flip-chip contacts;
- wherein the external contact pads and the contact connecting pads have an identical first metal alloy and the flat conductors have a different alloy from the the first metal alloy.
7 more elements
Dependencies are inferred from the claim text.