Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection
AssigneeVIA Technologies, Inc.
InventorsKwun-Yao Ho, Moriss Kung
Life of this patent
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Abstract
An electrical package and manufacturing method thereof is provided. A high stiffness, high electrical conductivity, low coefficient of thermal expansion and high thermal conductivity support substrate is used as an initial layer for building the package. A multilayer interconnection structure is formed over the support substrate. Thereafter, a plurality of openings is formed over the support substrate. The openings expose a plurality of bonding pads on a bottom surface of the multi-layer interconnection structure. An electronic device is set up over the multi-layer interconnection structure. Contacts are formed inside the opening over the bonding pads.
Claims12
An electrical package comprising:
- a multi-layer interconnection structure having a top surface, a bottom surface and an inner circuit therein, wherein the inner circuit has a plurality of bonding pads on the bottom surface of the multi-layer interconnection structure;
- at least an electronic device positioned on the top surface of the multi-layer interconnection structure and electrically connected to the inner circuit of the multi-layer interconnection structure;
- a support substrate made from a conductive material, wherein the support substrate is positioned on the bottom surface of the multi-layer interconnection structure, and the support substrate has a plurality of first openings, each first opening exposing one of the corresponding bonding pads;
- and
- an insulation layer covering the support substrate and exposing the bonding pads.
Dependencies are inferred from the claim text.