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US 7,071,566 B2Granted
Multi-substrate package assembly
AssigneeHoneywell International Inc.
InventorsBarrett E. Cole, Robert E. Higashi, Christopher J. Zins, Subash Krishnankutty
Life of this patent
Estimating the term…
Abstract
A spectrally tunable optical detector and methods of manufacture therefore are provided. In one illustrative embodiment, the tunable optical detector includes a tunable bandpass filter, a detector and readout electronics, each supported by a different substrate. The substrates are secured relative to one another to form the spectrally tunable optical detector.
Claims16
An assembly, comprising:
- a first substrate having a first opposing surface and a second opposing surface, and further having a number of bond pads on the first opposing surface;
- a second substrate having a first opposing surface and a second opposing surface, and further having a number of bond pads on the first opposing surface;
- a package having two major opposing surfaces with a cavity defined by an indentation in at least one of the two opposing surfaces resulting in a cavity defining surface that includes at least one side surface and a bottom surface, wherein the cavity includes a space that is at least partially defined by the cavity defining surface, the cavity having a number of package bond pads positioned along or adjacent to at least part of a periphery of the cavity;
- the first substrate and the second substrate positioned in the space that is at least partially defined by the cavity, wherein the second substrate is positioned between the first substrate and the bottom surface of the cavity defining surface such that the first opposing surface of the second substrate faces the first substrate;
- selected bond pads on the first opposing surface of the first substrate being electrically connected to selected package bond pads;
- and
- selected bond pads on the first opposing surface of the second substrate being electrically connected to selected package bond pads.
4 more elements
An assembly, comprising:
- a first substrate having a number of bond pads;
- a package frame having a number of bond pads with selected bond pads electrically connected to selected bond pads of the first substrate, the bond pacts being on a top surface of the package frame;
- a second substrate having a number of bond pads;
- a package separate from the first substrate having two major opposing surfaces with a cavity defined by an indentation in at least one of the two opposing surfaces, wherein the cavity includes at least a side surface and a bottom surface, the cavity having a number of bond pads positioned along or adjacent to at least part of a periphery of the cavity;
- the second substrate positioned in the cavity of the package between the first substrate and the bottom surface of the cavity, with selected bond pads of the second substrate being electrically connected to selected bond pads of the package;
- and
- the package frame and the first substrate are positioned above and adjacent the second substrate, with selected bond pads of the first substrate and/or package frame being electrically connected to selected bond pads of the package;
- wherein the package frame and the first substrate are positioned within the cavity.
5 more elements
An assembly, comprising:
- a first substrate having a first opposing surface and a second opposing surface, and further having a number of bond pads on the first opposing surface;
- a second substrate having a first opposing surface and a second opposing surface, and further having a number of bond pads on the first opposing surface;
- a third substrate having a first opposing surface and a second opposing surface, and further having a number of bond pads on the first opposing surface;
- a package having two major opposing surfaces with a cavity defined by an indentation in at least one of the two opposing surfaces resulting in a cavity defining surface that includes at least one side surface and a bottom surface, wherein the cavity includes a space that is at least partially defined by the cavity defining surface;
- and
- the first substrate, the second substrate and the third substrate all positioned in the space that is at least partially defined by the cavity, wherein the second substrate is positioned between the third substrate and the bottom surface of the cavity defining surface, and the first substrate is positioned adjacent to the second opposing surface of the third substrate such that the first opposing surface of the second substrate faces the first opposing surface of the third substrate, wherein the second opposing surface of the first substrate is positioned adjacent to the second opposing surface of the third substrate, and wherein at least some of the bond pads of the first substrate are electrically connected to at least some of the bond pads of the third substrate.
3 more elements
Dependencies are inferred from the claim text.