Patterning three dimensional structures
AssigneeSanDisk 3D LLC
InventorsCalvin K. Li, N. Johan Knall, Michael A. Vyvoda, James M. Cleeves, Vivek Subramanian
Life of this patent
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Abstract
A three dimensional circuit structure including tapered pillars between first and second signal lines. An apparatus including a first plurality of spaced apart coplanar conductors disposed in a first plane over a substrate; a second plurality of spaced apart coplanar conductors disposed in a second plane, the second plane parallel to and different from the first plane; and a plurality of cells disposed between one of the first conductors and one of the second conductors, wherein each of the plurality of cells have a re-entrant profile.
Claims16
A structure in a three dimensional circuit wherein the three dimensional circuit comprises a plurality of memory cell levels built over a substrate, the structure comprising tapered pillars between first and second signal lines.
An apparatus comprising:
- a first plurality of spaced apart coplanar conductors disposed in a first plane over a substrate;
- a second plurality of spaced apart coplanar conductors disposed in a second plane, the second plane parallel to and different from the first plane and the substrate;
- and
- a plurality of cells coupled to and disposed between one of the first conductors and one of the second conductors,
- wherein each of the plurality of cells has a re-entrant profile, and
- wherein at least one of the plurality of cells comprises an active device.
A three dimensional circuit structure comprising tapered pillars between first and second signal lines disposed in different planes over a substrate, the tapered pillars comprising at least one active device.
Dependencies are inferred from the claim text.