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US 7,071,561 B2Granted
Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorKer-Min Chen
Life of this patent
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Abstract
A semiconductor device having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least one second bond pad comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least one second bond pad, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
Claims13
An integrated circuit die, comprising:
- a workpiece;
- a plurality of input/output cells formed over the workpiece;
- a plurality of first bond pads disposed over the input/output cells, wherein each first bond pad is electrically coupled to one of the underlying input/output cells, the first bond pads forming a first pattern;
- and
- a plurality of second bond pads disposed proximate the input/output cells, each second bond pad being spaced apart from and disposed near a side of an input/output cell, each second bond pad being electrically coupled to one of the input/output cells, the second bond pads forming a second pattern, wherein the second pattern is different from the first pattern.
2 more elements
Dependencies are inferred from the claim text.