Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
OwnerJinghui Muinventor
Life of this patent
Estimating the term…
Abstract
A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.
Claims18
A tape ball grid array package comprising:
- a conductive supporting structure;
- an integrated circuit chip attached to the conductive supporting structure;
- a substrate attached to the conductive supporting structure, the substrate including a patterned metal layer and a dielectric layer, the patterned metal layer being electrically connected to the integrated circuit chip;
- and
- a direct electrical connection between the conductive supporting structure and the patterned metal layer,
- wherein the direct electrical connection is a wirebond connected between the conductive supporting structure and the patterned metal layer.
A tape ball grid array package comprising:
- a metal stiffener with a recessed region;
- an integrated circuit chip attached to the metal stiffener at the recessed region;
- a tape substrate attached to the metal stiffener, the tape substrate including a patterned metal layer and a dielectric layer, the pattern metal layer being electrically connected to the integrated circuit chip via a first wirebond, the patterned metal layer further being electrically connected to the metal stiffener via a second wirebond;
- and
- a plurality of solder balls attached to the tape substrate, some of the solder balls being electrically connected to the patterned metal layer of the tape substrate such that the metal stiffener is electrically connected to at least one of the solder balls through the second wirebond and the patterned metal layer.
A tape ball grid array package comprising:
- a conductive supporting structure;
- an integrated circuit chip attached to the conductive supporting structure;
- a substrate attached to the conductive supporting structure, the substrate including a patterned metal layer and a dielectric layer, the patterned metal layer being electrically connected to the integrated circuit chip;
- and
- a direct electrical connection between the conductive supporting structure and the patterned metal layer,
- wherein the conductive supporting structure includes a protruding member on the same side of the conductive supporting structure on which the integrated circuit chip, is attached, the protruding member being configured to substantially surround the integrated circuit chip attached to the conductive supporting structure.
Dependencies are inferred from the claim text.