Assemblies having stacked semiconductor chips and methods of making same
AssigneeTessera, Inc.
InventorsTeck-Gyu Kang, Yoichi Kubota
Life of this patent
Estimating the term…
Abstract
A stacked microelectronic assembly comprises a continuous sheet including a core panel and a plurality of side panels, each having a folded portion that connects the side panel to an edge of the core panel. At least two of the panels are at least partially horizontally aligned with one another in a stack. During manufacture of a stacked microelectronic assembly, failed microelectronic elements are identified and associated side panels thereof are simply cut-off. This results in the production of a usable stacked microelectronic assembly albeit of reduced capacity, or reduced functionality.
Claims17
A stacked microelectronic assembly comprising:
- a continuous sheet having oppositely-directed obverse and reverse surfaces, the sheet including a core panel having edges, the sheet further including at least two side panels, each of the side panels having a folded portion connecting that side panel to the core panel along one of the edges so that when folded to form a stack with the core panel the at least two side panels are substantially aligned in a plane substantially parallel to the core panel;
- microelectronic elements mounted on at least two of the panels;
- terminals on the core panel, said terminals being movable with respect to the microelectronic elements mounted on the panels;
- and
- one or more wiring layers including traces extending along the sheet between the panels by way of the folded portions, at least some of the traces connecting the microelectronic elements to at least some of the terminals.
A stacked microelectronic assembly comprising:
- a continuous sheet having oppositely-directed obverse and reverse surfaces, the sheet including a core panel having edges, the sheet further including at least two side panels, each of the side panels having a folded portion connecting that side panel to the core panel along one of the edges;
- a first microelectronic element mounted on a first one of the at least two of the panels;
- a second microelectronic element mounted on a second one of the at least two of the panels;
- a third microelectronic element mounted on the core panel, said first microelectronic element and said second microelectronic element being positioned on a common plane, said common plane being parallel to and remote from said core panel;
- terminals on the sheet;
- and
- one or more wiring layers including traces extending along the sheet between the panels by way of the folded portions, at least some of the traces connecting the microelectronic elements to at least some of the terminals.
Dependencies are inferred from the claim text.