Semiconductor device and manufacturing method thereof
AssigneeOki Electric Industry Co., Ltd.
InventorSunji Ichikawa
Life of this patent
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Abstract
A semiconductor device includes a die pad section, a first semiconductor chip having a surface formed with a first electrode section and a back surface fixed to the die pad section, a second semiconductor chip having a surface formed with a second electrode section and a back surface fixed to the surface of the first semiconductor chip, a support member having a surface fixed to the back surface of the second semiconductor chip and a back surface fixed to the die pad section, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section, the first and second semiconductor chips and the support member.
Claims21
A semiconductor device comprising:
- a lead frame including a die pad section and leads having lead terminal sections;
- a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the die pad section;
- a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip;
- a support member having a surface fixed to the back surface of the second semiconductor chip and a back surface fixed to the die pad section, the;
- lead terminal sections respectively electrically connected to the first and second electrode sections;
- and
- a resin encapsulating body that seals the die pad section, the first and second semiconductor chips and the support member,
- wherein a first side surface of the support member is located directly under the second semiconductor chip, and a second side surface of the support member opposite the first side surface is located out from under the second semiconductor chip.
A semiconductor device comprising:
- a lead frame including a die pad section and leads having lead terminal sections;
- a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the die pad section;
- a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip;
- a support member having a surface fixed to the back surface of the second semiconductor chip and a back surface fixed to the die pad section and first portions of the lead terminal sections;
- wirings respectively electrically connecting the first and second electrode sections to the first portions of the lead terminal sections;
- and
- a resin encapsulating body that seals the die pad section, the first portions of the lead terminal sections, the first and second semiconductor chips and the support member.
Dependencies are inferred from the claim text.