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US 7,071,537 B2Granted
Power device having electrodes on a top surface thereof
AssigneeIXYS Corporation
InventorsUlrich Kelberlau, Nathan Zommer
Life of this patent
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Abstract
A power device includes a substrate assembly including an upper surface and a lower surface. The substrate assembly includes a first layer and a second layer. The first layer overlies the second layer and has different conductivity than the second layer. A first electrode is provided proximate the upper surface. A second electrode is provided proximate the upper surface and is spaced apart from the first electrode. The second layer is configured to provide a current path between the first and second electrodes.
Claims17
A diode configured to provide a vertical current flow, the power device comprising:
- a substrate assembly including an upper surface and a lower surface, the substrate assembly including a first layer and a second layer, the first layer overlying the second layer and having different conductivity than the second layer;
- a first electrode provided proximate the upper surface;
- a second electrode provided proximate the upper surface, the second electrode being spaced apart from the first electrode;
- a trench proximate the upper surface and extending into the first layer and at least a portion of the second layer, the second electrode being formed on the trench and contacting the second layer, the trench extending at least about 5 microns into the second layer;
- and
- a metal layer formed on the lower surface of the substrate assembly to provide a conductive path between the first and second electrodes,
- wherein the second layer is configured to provide a current path between the first and second electrodes, so that current flows vertically downward from one of the first and second electrodes to the second layer and then to the other of first and second electrodes from the second layer, wherein the current is 1 ampere or more.
4 more elements
A power device, comprising:
- a first layer of first conductivity having a first surface and a second surface;
- a second layer of second conductivity provided below the second surface, the second layer having a higher conductivity than the first layer;
- a first electrode provided proximate the first surface of the first layer;
- a groove extending into the second layer from the first surface of the first layer, the groove extending at least about 10 microns into the second layer;
- a second electrode formed overlying the groove and contacting the second layer, and
- a conductive layer provided below the second layer,
- wherein the second layer and the conductive layer are configured to provide a current path between the first and second electrodes,
- wherein the power device is a diode.
5 more elements
A power device configured to provide a vertical current flow, the power device comprising:
- a substrate assembly including an upper surface and a lower surface, the substrate assembly including a first layer and a second layer, the first layer overlying the second layer and having different conductivity than the second layer;
- a first electrode provided proximate the upper surface;
- a second electrode provided proximate the upper surface, the second electrode being spaced apart from the first electrode;
- a trench proximate the upper surface and extending into the first layer and at least a portion of the second layer, the second electrode being formed on the trench and contacting the second layer, the trench extending at least about 10 microns into the second layer;
- and
- a metal layer provided proximate the lower surface of the substrate,
- wherein the second layer and the metal layer are configured to provide a current path between the first and second electrodes, so that current flows vertically downward from one of the first and second electrodes to the second layer and then to the other of the first and second electrodes via a conductive layer,
- wherein the current is 1 ampere or more,
- wherein the power device is a diode.
6 more elements
A power device configured to provide a vertical current flow, the power device comprising:
- a substrate assembly including an upper surface and a lower surface, the substrate assembly including a first layer and a second layer, the first layer overlying the second layer and having different conductivity than the second layer;
- a first electrode provided proximate the upper surface;
- a second electrode provided proximate the upper surface, the second electrode being spaced apart from the first electrode;
- a conductive layer provided on the lower surface of the substrate;
- and
- a trench proximate the upper surface and extending into the first layer and at least a portion of the second layer, the second electrode being formed within the trench and contacting the second layer, the trench extending at least about 5 microns into the second layer to provide a suitable current path coupling the first and second electrodes,
- wherein the second layer and the conductive layer are configured to provide a current path between the first and second electrodes, so that current flows vertically downward from one of the first and second electrodes to the second layer and then to the other of the first and second electrodes via the conductive layer provided on the lower surface of the substrate,
- wherein the power device is a diode.
5 more elements
Dependencies are inferred from the claim text.