Adjustable self-aligned air gap dielectric for low capacitance wiring
AssigneeInternational Business Machines Corporation
InventorsRobert M. Geffken, William T. Motsiff
Life of this patent
Estimating the term…
Abstract
An adjustable self aligned low capacitance integrated circuit air gap structure comprises a first interconnect adjacent a second interconnect on an interconnect level, spacers formed along adjacent sides of the first and second interconnects, and an air gap formed between the first and second interconnects. The air gap extends above an upper surface of at least one of the first and second interconnects and below a lower surface of at least one of the first and second interconnects, and the distance between the spacers defines the width of the air gap. The air gap is self-aligned to the adjacent sides of the first and second interconnects.
Claims15
A semiconductor device comprising:
- a first interconnect adjacent a second interconnect on an interconnect level;
- beneath at least one of the first and second interconnects, an etch stop layer positioned over an underlying via insulator level;
- spacers formed along adjacent sides of the first and second interconnects;
- and
- an air gap formed between the first and second interconnects, the air gap extending above an upper surface of at least one of the first and second interconnects and the air gap extending below a lower surface of the at least one of the first and second interconnects having the etch stop layer beneath by a distance corresponding to a thickness of the etch stop layer, distance between the spacers defining the width of the air gap.
Dependencies are inferred from the claim text.