Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

A semiconductor module comprising:

• a resin package including a first surface, and a second surface which is different from the first surface;
• a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;
• a semiconductor element mounted to the inner portion of the lead and covered by the resin package;
• and
• a conductive film provided separately from the lead for covering at least the second surface of the resin package, the conductive film being provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package;
• wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film at the second surface of the resin package;
• and
• wherein the inner portion of the lead is formed with a recess for accommodating the semiconductor element;
• wherein the resin package further includes a third surface extending between the first and second surfaces of the resin package and a fourth surface opposite to the third surface;
• wherein the inner portion of the lead further includes a second extension extending toward the third surface of the resin package, and a third extension extending toward the fourth surface of the resin package;
• wherein the second extension is held in contact with the conductive film at the third surface of the resin package;
• and
• wherein the third extension is held in contact with the conductive film at the fourth surface of the resin package.

A semiconductor module comprising:

• a resin package including a first surface, and a second surface which is different from the first surface;
• a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;
• a semiconductor element mounted to the inner portion of the lead and covered by the resin package;
• and
• a conductive film provided separately from the lead for covering at least the second surface of the resin package, the conductive film being provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package;
• wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film at the second surface of the resin package;
• and
• wherein the outer portion of the lead includes an upper surface, a lower surface and two opposite side surfaces, the connecting portion of the conductive film being held in contact with the upper, lower and two side surfaces of the outer portion of the lead.