Molding system with integrated film heaters and sensors
AssigneeHusky Injection Molding Systems Ltd.
InventorsHarold Godwin, George Olaru, David Whiffen
Life of this patent
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Abstract
Film heater apparatus and method for heating a melt channel in a molding device includes structure and/or steps whereby a first dielectric layer is disposed on a surface of a substrate. An active heating element is disposed on the first dielectric layer, the active heating element being configured to generate heat to heat the melt channel. The active heating element has contact terminals arranged to support an electrical connection to the active heating element. A second dielectric layer is disposed over the active heating element, but not covering the contact terminals, thereby permitting coupling of the heater element to an electrical supply.
Claims34
A film heater for heating a melt channel in a molding apparatus, the heater comprising:
- a heat conducting substrate;
- a first dielectric layer on a surface of said substrate;
- an active heating film element on said first dielectric layer, said active heating element being configured to cause heating through said heat conducting substrate, said active heating element comprising a pattern that includes film contact terminals that are configured to support an electrical connection to said active heating element;
- and
- a second dielectric layer extending over said active heating element, but not covering the film contact terminals, so that the contact terminals are configured to couple the active heating element to an electrical supply.
A method of manufacturing a molding film heater, comprising the steps of:
- forming a first dielectric layer on a surface of a substrate;
- depositing an active heating film element in a predefined pattern, which pattern includes contact terminals, on said first dielectric layer, said depositing step being selected from among a group of steps consisting of ion plating, sputtering, chemical vapor deposition, physical vapor deposition, applying a conductive ink, and flame spraying;
- and
- forming a second dielectric layer over said active heating element but not covering the contact terminals, thereby permitting, coupling of the heater element to an electrical supply.
A molding machine nozzle heater, comprising:
- a heat conducting substrate;
- a first dielectric film disposed on a surface of said substrate;
- a resistive film disposed on said first dielectric layer, said resistive film comprising (i) a film heating element configured to cause heating through said heat conducting substrate, and (ii) at least one film contact terminal configured to support an electrical connection to said film heating element, said at least one film contact terminal having a width which is greater than a width of said film heating element;
- and
- a second dielectric layer extending over said film heating element.
Dependencies are inferred from the claim text.