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US 7,071,423 B2Granted
Circuitized substrate assembly and method of making same
AssigneeEndicott Interconnect Technologies, Inc.
InventorsJames W. Fuller, Jr., John M. Lauffer, Voya R. Markovich
Life of this patent
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Abstract
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
Claims9
A circuitized substrate assembly comprising:
- a first circuitized substrate including an opening therein;
- a second circuitized substrate bonded to said first circuitized substrate and including an opening therein aligned with said opening in said first circuitized substrate;
- an electrically conductive cover member substantially covering said opening in said second circuitized substrate on the surface of said second circuitized substrate facing said first circuitized substrate;
- a quantity of electrically conductive paste positioned on said cover member and only partly filling said opening in said first circuitized substrate;
- and a layer of dielectric material positioned on an external surface of said first circuitized substrate and extending within said opening of said first circuitized substrate.
2 more elements
Dependencies are inferred from the claim text.