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US 7,071,422 B2Granted
Electronic circuit comprising conductive bridges and method for making such bridges
AssigneeNagraID S.A.
InventorFrançois Droz
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AssigneeNagraID S.A.
InventorFrançois Droz
Estimating the term…
The aim of this invention is to obtain a very cheap electronic circuit used for example in a card or a label while maintaining high reliability. It particularly concerns the connection of one or several electronic components on the conductive tracks by means of conductive bridges that traverse the substrate. The electronic circuit according to the invention includes at least one electronic component (6), a substrate (5), on a first face of this substrate an adhesive layer and a conductive layer including a plurality of tracks (4) are applied. The electronic component (6) comprises at least two connection areas (7). One of these connection areas (7) is electrically linked to the conductive layer by a conductive bridge formed by a conductive segment (1) delimited in the conductive layer only. Said segment (1), free from any adhesive substance, traverses the substrate (5) through a passage (2, 3) and links the connection area (7).
Electronic circuit comprising at least one electronic component (6), a substrate (5), constituted by a flexible insulating material, on a first face of this substrate (5) an adhesive layer and a conductive layer including a plurality of tracks (4) are applied, said component (6) including at least two connection areas (7), at least one of these connection areas (7) being electrically linked to the conductive layer by a conductive bridge, characterized in that the substrate includes at least one sensibly rectangular strip (2, 3) made by incisions in the substrate (5) on three sides, the last side being attached to said substrate (5), and in that the bridge is formed by a conductive segment (1) delimited in the conductive layer only, said segment (1), free from any adhesive substance, traverses the substrate (5) through one of said strip (2, 3) incisions of and links the connection area (7).
Method for manufacturing an electronic circuit comprising a substrate (5), constituted by a flexible insulating material, at least one adhesive layer and a conductive layer including a plurality of tracks (4) and an electronic component (6), characterized in that the execution of a bridge between a zone of the conductive layer and a target connection area (7), includes the following steps:
Dependencies are inferred from the claim text.