Epoxy adhesives and bonded substrates
Assignee3M Innovative Properties Company
InventorsMing Cheng, Ying-Yuh Lu
Life of this patent
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Abstract
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
Claims15
An epoxy adhesive comprising:
- about 30% to about 40% weight, based upon the total weight of the epoxy adhesive, of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from the group consisting of epoxide, isocyanate, and amine;
- and wherein the oligomer has a molecular weight range from about 500 to about 20,000 when the oligomer is epoxy-terminated;
- an amine curative;
- and
- an epoxide-group containing compound;
- wherein the epoxy adhesive when cured passes the Thermal Shock Test and has a Shear Creep of about 10 microns or less.
A two part epoxy adhesive comprising:
- (i) a first part comprising:
- about 60% to 85% by weight, based upon the total weight of the epoxy adhesive, of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two amine functional groups;
- and
- about 10% to 35% weight, based upon the total weight of the epoxy adhesive, of an amine curative;
- and
- (ii) a second part comprising:
- an epoxide-group containing compound;
- wherein the epoxy adhesive when cured passes the Thermal Shock Test and has a Shear Creep of about 10 microns or less.
A two part epoxy adhesive comprising:
- (i) a first part comprising an amine curative;
- (ii) a second part comprising:
- about 30% to 50% by weight, based upon the total weight of the epoxy adhesive, of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from the group consisting of epoxide and isocyanate, wherein the reactive oligomer has a molecular weight range from about 500 to about 20,000 when the oligomer is epoxy-terminated;
- and
- an epoxide-group containing compound;
- wherein the epoxy adhesive when cured passes the Thermal Shock Test and has a Shear Creep of about 10 microns or less.
Dependencies are inferred from the claim text.