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AssigneeHitachi Chemical Company, Ltd.
InventorsKuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Takao Hirayama, Toshizumi Yoshino
Estimating the term…
A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.
A semiconductor package including a photo curable resin composition which comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the elastomer (B) is included in an amount of 2–50 parts by weight on the basis of 100 parts by weight of said acid-modified vinyl group-containing epoxy resin (A).
Dependencies are inferred from the claim text.