Integrated treatment method for obtaining robust low dielectric constant materials

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment being a treatment other than a thermal treatment;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, wherein applying a first treatment comprises subjecting the low dielectric material to a treatment selected from a group consisting of hydrogen-based plasma, electron beam, ultraviolet radiation, and microwave hydrogen plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment being a treatment other than a thermal treatment;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, wherein applying a second treatment comprises subjecting the low dielectric material after the first treatment to a treatment selected from a group consisting of hydrogen-based plasma, electron beam, ultraviolet radiation, and carbon-based plasma, microwave hydrogen plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, the second treatment being a treatment other than a thermal treatment.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, the second treatment being a treatment other than a thermal treatment, wherein applying a first treatment comprises subjecting the low dielectric material to a treatment selected from a group consisting of hydrogen-based plasma, electron beam, high temperature, ultraviolet radiation, and microwave hydrogen plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, the second treatment being a treatment other than a thermal treatment, wherein applying a second treatment comprises subjecting the low dielectric material after the first treatment to a treatment selected from a group consisting of hydrogen-based plasma, electron beam, ultraviolet radiation, and carbon-based plasma, microwave hydrogen plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with hydrogen-based plasma;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with hydrogen-based plasma;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, wherein applying the second treatment comprises a treatment selected from a group consisting of treating the low dielectric material with microwave hydrogen plasma and ultraviolet radiation.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with ultraviolet radiation;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with ultraviolet radiation;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, wherein applying the second treatment comprises a treatment selected from a group consisting of treating the low dielectric material with carbon-based plasma and a hydrogen plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with microwave hydrogen plasma;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability;
• and
• wherein one of the first and second treatment comprises treating the low dielectric material with a plasma.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability;
• and
• wherein one of the first and second treatment comprises treating the low dielectric material with ultraviolet radiation.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material;
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability;
• and
• wherein one of the first and second treatment comprises treating the low dielectric material with an electron beam.

An integrated method comprising:

• providing a low dielectric material;
• applying a first treatment altering a first property of the low dielectric material, the first treatment treating the low dielectric material with high temperature;
• and
• applying a second treatment altering a second property of the treated low dielectric material and producing a lower dielectric material with better mechanical stability, the second treatment treating the low dielectric material with a plasma.