Method of making a semiconductor chip assembly with a carved bumped terminal

A method of making a semiconductor chip assembly, comprising:

• providing a metal base;
• then
• forming a recess in the metal base;
• then
• forming a routing line and a bumped terminal on the metal base, wherein the routing line and the bumped terminal are contiguous with one another and contact the metal base, the routing line is disposed outside the recess, and the bumped terminal extends into the recess and includes a cavity that extends into and faces away from the recess;
• then
• forming a metal filler on the bumped terminal, wherein the metal filler contacts the bumped terminal in the cavity and extends into the recess;
• then
• mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
• forming a connection joint that electrically connects the routing line and the pad;
• forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the metal filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the metal filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the metal filler in the second direction, the bumped terminal extends vertically beyond the routing line and the metal filler in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
• etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the metal filler;
• and then
• grinding the bumped terminal, thereby exposing the metal filler in the cavity such that the cavity extends through the bumped terminal in the second direction.

A method of making a semiconductor chip assembly, comprising:

• providing a metal base;
• then
• forming a recess in the metal base;
• then
• forming a routing line and a bumped terminal on the metal base, wherein the routing line and the bumped terminal are contiguous with one another and contact the metal base, the routing line is disposed outside the recess, and the bumped terminal extends into the recess and includes a cavity that extends into and faces away from the recess;
• then
• forming a metal filler on the bumped terminal, wherein the metal filler contacts the
• bumped terminal in the cavity and extends into the recess;
• then
• mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler using an insulative adhesive, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
• forming a connection joint that electrically connects the routing line and the pad after attaching the chip to the metal base, the routing line, the bumped terminal and the metal filler;
• forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the metal filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the metal filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the metal filler in the second direction, the bumped terminal extends vertically beyond the routing line and the metal filler in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
• etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the metal filler;
• and then
• grinding the bumped terminal, thereby exposing the metal filler in the cavity such that the cavity extends through the bumped terminal in the second direction.

A method of making a semiconductor chip assembly, comprising:

• providing a metal base;
• then
• forming a recess in the metal base;
• then
• forming a routing line and a bumped terminal on the metal base, wherein the routing line and the bumped terminal are contiguous with one another and contact the metal base, the routing line is disposed outside the recess, and the bumped terminal extends into the recess and includes a cavity that extends into and faces away from the recess;
• then
• forming a metal filler on the bumped terminal, wherein the metal filler contacts the bumped terminal in the cavity and extends into the recess;
• then
• mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the metal filler, wherein the chip includes first and second opposing surfaces, and the first surface of the chip includes a conductive pad;
• forming a connection joint that electrically connects the routing line and the pad;
• forming an encapsulant after attaching the chip to the metal base, the routing line, the bumped terminal and the metal filler, wherein the encapsulant includes a first surface that faces in a first direction and a second surface that faces in a second direction opposite the first direction, the encapsulant covers the chip and extends vertically beyond the chip, the metal base, the routing line, the bumped terminal and the metal filler in the first direction, the chip is embedded in the encapsulant, the metal base extends vertically beyond the chip, the routing line, the bumped terminal and the metal filler in the second direction, the bumped terminal extends vertically beyond the routing line and the metal filler in the second direction, and the cavity extends through the bumped terminal in the first direction but not the second direction and is covered by the metal base and the bumped terminal in the second direction;
• etching the metal base after forming the encapsulant, thereby exposing the routing line and the bumped terminal without exposing the metal filler;
• forming an insulative base that covers and extends vertically beyond the chip, the routing line, the bumped terminal, the metal filler and the encapsulant in the second direction;
• then
• grinding the insulative base without grinding the bumped terminal and without grinding the metal filler;
• then
• grinding the insulative base and the bumped terminal without grinding the metal filler;
• and then
• grinding the insulative base, the bumped terminal and the metal filler, wherein the bumped terminal, the cavity, the metal filler and the insulative base are laterally aligned at a surface that faces in the second direction and the cavity extends through the bumped terminal in the second direction.