Methods for forming wiring and electrode
AssigneesJsr Corporation, Sharp Kabushiki Kaisha, International Center for Materials Research
InventorsYasuaki Yokoyama, Isamu Yonekura, Takashi Satoh, Tamaki Wakasaki, Yasumasa Takeuchi, Masayuki Endo
Life of this patent
Estimating the term…
Abstract
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.
Claims11
A method for forming a conductive film, comprising coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound, and (B) a titanium compound and than subjecting the obtained coating film to heating and/or a light treatment to form a conductive film.
A method for forming a conductive film, comprising coating a substrate with a composition comprising (A) a complex of an amino compound and a hydrogenated aluminum compound, and (C) metal particles and then subjecting the obtained coating film to heating and/or a light treatment to form a conductive film.
Dependencies are inferred from the claim text.